Compare · ASX vs TSM
ASX vs TSM
Side-by-side comparison of ASE Technology Holding Co. Ltd. (ASX) and Taiwan Semiconductor Manufacturing Company Ltd. (TSM): market cap, price performance, sector, and recent activity on the wire.
Summary
- Both ASX and TSM operate in Semiconductors (Technology), so they compete in similar markets.
- TSM is the larger of the two at $2.23T, about 22.6x ASX ($98.72B).
- TSM has been more active in the news (36 items in the past 4 weeks vs 5 for ASX).
- TSM has more recent analyst coverage (23 ratings vs 9 for ASX).
- Company
- ASE Technology Holding Co. Ltd.
- Taiwan Semiconductor Manufacturing Company Ltd.
- Price
- -
- -
- Market cap
- $98.72B
- $2.23T
- 1M return
- -
- -
- 1Y return
- -
- -
- Industry
- Semiconductors
- Semiconductors
- Exchange
- NYSE
- NYSE
- IPO
- 2018
- 1997
- News (4w)
- 5
- 36
- Recent ratings
- 9
- 23
ASE Technology Holding Co. Ltd.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. ASE Technology Holding Co., Ltd. was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Manufacturing Company Limited manufactures and sells integrated circuits and semiconductors. It also offers customer service, account management, and engineering services. The company serves customers in computer, communications, consumer, and industrial and standard segments in North America, Europe, Japan, China, and South Korea. Taiwan Semiconductor Manufacturing Company Limited was founded in 1987 and is headquartered in HsinChu, Taiwan.
Latest ASX
- SEC Form 4 filed by ASE Technology Holding Co. Ltd.
- ASE Expands PowerSiP™ Platform for Next-Generation AI Power Delivery
- SEC Form 6-K filed by ASE Technology Holding Co. Ltd.
- ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*
- Director Chang Hung Pen exercised 300,000 units of Ordinary Shares at a strike of $98.60, increasing direct ownership by 7% to 4,800,000 units (SEC Form 4)
- Chairman & President, SPIL Tsai Chi-Wen was granted 334,000 units of Ordinary Shares, increasing direct ownership by 2% to 15,598,000 units (SEC Form 4)
- GM, ASE Japan & Wuxi Tongzhi Chung Chih-Hsiao was granted 30,000 units of Ordinary Shares, increasing direct ownership by 8% to 425,000 units (SEC Form 4)
- CEO, ISE Labs Hsiang Kenneth was granted 40,000 units of Ordinary Shares, increasing direct ownership by 58% to 109,000 units (SEC Form 4)
- GM, ASE Shanghai & Electronics Lin Chung was granted 30,000 units of Ordinary Shares, increasing direct ownership by 21% to 170,278 units (SEC Form 4)
- GM TW & Kaohsiung Pkg Facility Lo Raymond was granted 400,000 units of Ordinary Shares, increasing direct ownership by 10% to 4,383,430 units (SEC Form 4)
Latest TSM
- TGE Value Creative Solutions Celebrates Recent NYSE Listing: NYSE Content Update
- SEC Form 6-K filed by Taiwan Semiconductor Manufacturing Company Ltd.
- AI Revenue Questions Pull Semiconductor Stocks Off October Highs
- Fusion’s Prove-It Era Just Delivered a World-First Result
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by Taiwan Semiconductor Manufacturing Company Ltd.