FREMONT, CA / ACCESSWIRE / June 26, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that President and CEO Gayn Erickson will be participating in the 16th Annual CEO Investor Summit 2024 being held Wednesday, July 10^th at the St. Regis Hotel, San Francisco, CA.

"I once again look forward to participating in this annual event and discussing our unique wafer level test and burn-in solutions for semiconductor production and the markets they serve with investors and shareholders," said Mr. Erickson. "Aehr Test provides complete production solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, gallium nitride devices for multiple power conversion applications, and silicon photonics devices used in data centers and 5G infrastructure, as well as for new applications such as optical input/output (I/O) and co-packaged optics devices, flash memories, and artificial intelligence (AI) processors that are on the horizon. The adoption of wafer level test and burn-in of these devices is a significant growth driver for Aehr Test."

The presentation material utilized at the CEO Summit will be made available on the investor relations page of the Company's website at www.aehr.com.

About the 16th Annual CEO Investor Summit 2023

The CEO Investor Summit is collectively hosted and funded by participating companies and features a "round-robin" format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 13 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is June 28, 2024.

RSVP Contacts for 16th Annual CEO Investor Summit 2024

To RSVP for the CEO Investor Summit, please contact either of the event co-chairs.

Laura J. Guerrant-Oiye
Phone: (808) 960-2642
Email: lauraoiye@gmail.com

Claire E. McAdams
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For more information, please visit Aehr Test Systems' website at www.aehr.com.

Contacts:

Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com

SOURCE: Aehr Test Systems

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