TAINAN, Taiwan, Sept. 08, 2026 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (NASDAQ:HIMX) ("Himax" or the "Company"), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the unveiling of the industry-leading automotive TDDI (Touch and Display Driver Integration) with high-speed eDP interface support, the HX83196/HX83197 series. The new solution integrates a high-speed eDP interface, touch, and display driver into a single chip, addressing the demands of next-generation smart car displays for large-format, high-resolution, high-quality displays and responsive touch performance.

Himax’s new eDP TDDI adopts the latest eSRE (eDP Stream Regeneration Engine) technology, integrating TDDI with eDP transmission and reception functions into a single chip. It can directly receive and transmit high-bandwidth eDP signals, enabling cascaded configuration. Customers can flexibly adopt either a single-chip or two-chip cascaded design, depending on panel size and resolution requirements. The HX83197 further incorporates Himax’s industry-leading local dimming technology into the TDDI, eliminating the need for an additional Tcon while enhancing contrast and detail in bright and dark areas, with improved cost efficiency. The newly introduced eDP TDDI is currently in the design-in stage with multiple panel makers and will be showcased at the upcoming SID Vehicle Displays and Interfaces Symposium in Detroit, U.S.

The new eDP TDDI features the following advanced capabilities:

Flexible Cascading for Large-Format, High-Resolution Displays: The automotive display system requires only one eDP output interface to cascade two eDP TDDIs. A single eDP TDDI supports displays up to 17 inches with 3K resolution, while a two-chip cascaded configuration supports displays up to 30 inches with 6K resolution
High-Resolution Touch Display with Smooth Visual Performance: Features 2,560 source channels and 1,280 touch channels, supporting 60Hz and 90Hz refresh rates, for large-format, high-resolution touch displays and smooth visual performance
High Integration for Simplified System Architecture and Improved Cost Efficiency: Integrating an eDP 1.2 interface eliminates the need for the eDP-to-OLDI bridge IC required in conventional automotive display architectures. For single-display applications, it also supports a Direct DP architecture, allowing the SoC to transmit eDP signals directly to the eDP TDDI over a single cable without an additional SerDes, further simplifying system architecture and reducing cost
Enhanced Data Transmission Efficiency and High-Quality Display: Integrates eDP 1.4 DSC (Display Stream Compression) technology to reduce the bit rate and power consumption associated with high-resolution image transmission, while helping mitigate electromagnetic interference (EMI). Support for HDR10+ enhances contrast and detail across bright and dark areas for more natural and refined image quality
ALS-on-Panel Architecture for Simplified Display Design: Supports an interface for an on-panel Ambient Light Sensor (ALS), allowing the ALS to be placed directly on the panel without occupying display bezel space, for a cleaner, more streamlined display design

"Himax has been deeply engaged in the automotive display IC market for nearly two decades, establishing a leading position across multiple technologies while building one of the industry’s most comprehensive automotive display IC portfolios. As the market trends toward larger, higher-resolution displays and increasingly diverse display configurations in smart car interiors, we continue to develop and introduce innovative technologies and products to give customers more options tailored to their needs. Our new eDP TDDI is one such example, supporting large-format, high-resolution automotive displays with advanced touch functionality while simplifying display design and reducing cost. Multiple customer projects are already underway," said Ming-Cheng Chiu, Executive Vice President of Touch and Display Business Unit at Himax.

About Himax Technologies, Inc.

Himax Technologies, Inc. (NASDAQ:HIMX) is a leading global fabless semiconductor solution provider dedicated to display imaging processing technologies. The Company’s display driver ICs and timing controllers have been adopted at scale across multiple industries worldwide including TVs, PC monitors, laptops, mobile phones, tablets, automotive, ePaper devices, industrial displays, among others. As the global market share leader in automotive display technology, the Company offers innovative and comprehensive automotive IC solutions, including traditional driver ICs, advanced in-cell Touch and Display Driver Integration (TDDI), local dimming timing controllers (Local Dimming Tcon), Large Touch and Display Driver Integration (LTDI) and OLED display technologies. Himax is also a pioneer in tinyML visual-AI and optical technology related fields. The Company’s industry-leading WiseEye^TM Ultralow Power AI Sensing technology which incorporates Himax proprietary ultralow power AI processor, always-on CMOS image sensor, and CNN-based AI algorithm has been widely deployed in consumer electronics and AIoT related applications. Himax optics technologies, such as diffractive wafer level optics, LCoS microdisplays and 3D sensing solutions, are critical for facilitating emerging AR/VR/metaverse technologies. Additionally, Himax designs and provides touch controllers, OLED ICs, LED ICs, EPD ICs, power management ICs, and CMOS image sensors for diverse display application coverage. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,200 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, and the US. Himax has 2,555 patents granted and 318 patents pending approval worldwide as of June 30, 2026.

http://www.himax.com.tw

Forward Looking Statements

Factors that could cause actual events or results to differ materially from those described include, but are not limited to, the effect of the Covid-19 pandemic on the Company’s business; general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortage in supply of key components; changes in environmental laws and regulations; changes in export license regulated by Export Administration Regulations (EAR); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2025 filed with the SEC, as may be amended.

Himax Contacts:

Karen Tiao, Head of IR/PR

Himax Technologies, Inc.

Tel: +886-2-2370-3999

Fax: +886-2-2314-0877

Email: hx_ir@himax.com.tw

http://www.himax.com.tw

Mark Schwalenberg, Director

Investor Relations - US Representative

MZ North America

Tel: +1-312-261-6430

Email: HIMX@mzgroup.us